UV and Non-UV Tapes

GTS now offers both UV and non-UV tape for both Dicing and Backgrind applications. The UV Dicing tape has higher adhesion strength as compared with ordinary non-UV tape. Once exposed to UV light, the amount of adhesion is reduced and in many cases less than non-UV tape and the adherent can be removed easily. The tape backing is made from non-halogen PO, PVC, PET and is expandable.

Some of the applications using UV and non-UV tape are ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and many more.

Please click the Tape Specs button below for more detailed information on which tape will best fit your application or contact us by phone or email to get more info.

SILICON/BGA/CSPORDER SAMPLE