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• All Wafer Washers
• DCS140
• Micro Automation 2066
• Ultra T SWC111
• Ultra T SWC111M

DCS140 Specifications

• Maximum workpiece: 8 inch
• Supported frames: 6 & 8 inch
• Cleaning method: High-pressure
• Table roating speed range (min-1): 0 - 3,000
• Spinner discharge pressure (MPa): 2.0 - 12.0
• Air pressure: 0.5 MPa
• Air flow rate: 216 L/min
• Clean air pressure: 0.5 MPa
• Clean air flow rate: 54 L/min
• Deionized Water: 0.2 to 0.4 MPa
• Deionized flow rate: 0.2 L/min max
• Power: 120VAC 10amp
• Machine dimensions (WxDxH) (mm): 400 x 719 x 1,220
• Machine weight (kg): About 150