Frequently Asked Questions
Although there are many variables to each of these questions, these are the most frequently asked questions.
Why buy refurbished equipment from GTS?
- One of the most cost effective ways to stretch a capital budget, while still getting OEM quality operation, is through purchasing refurbished equipment.
- GTS is a proven rebuilder, with our experience we can save time, money and avoid frustration. Our refurbished equipment will be set-up to match your application. Equipment purchased from auctions, brokers or others who do not refurbish equipment, may not be set up for your application, or may be missing parts and tooling.
- Warranty: GTS supports the equipment with warranty plus our experienced staff will assist in service issues, parts and applications.
- Refurbished equipment is environmentally friendly. One of the biggest problems of our time is "high-technology waste". Reusing equipment through refurbishing reduces the disposal of equipment that still has a relevant and productive use in industry.
Why am I getting so much chipping on one side?
- Chipping on one side of the cut is usually caused by incorrect position of the blade cooling water nozzle. This nozzle must be adjusted so the water stream is evenly divided on both sides of the blade. It is also critical in most applications, to have this stream contact the blade at the point were the blade enters the material, so that as much of the water as possible gets into the cut to cool the material and also flush out the saw dust slurry. This is especially critical when using resin blades on hard materials and thick materials. In many hard material cutting situations, it is critical to use high flow very directed water nozzle.
- Chipping on one side of the material can also be an effect of the spindle being misaligned in relation to the X-axis. Typically the spindle is within 10 microns or less of being a right angle to the X-axis. If it is out of spec., the blade will cut more on one side of the material than the other creating a much larger kerf and chipping.
Why am I getting bottom side chipping?
- Chipping on the bottom side is usually caused by incorrect cut depth. If the cut depth (blade height) is set too shallow, the blade will not dice through the material. The force will cause the material to crack.
- If a dicing tape is used, the adhesive or base film may be too thick. This causes the material to move during the dicing action. Wax that is being used as bond between the material to be diced and the substrate may also cause a problem.
Why does my cut depth vary across my substrate?
- The chuck flatness should be checked, and adjusted if required.
- If the wafer is mounted on tape, ensure there are no bubbles or debris between wafer and tape preventing the wafer from sitting flat on the chuck. Also check for debris on the chuck.
- If the wafer to be cut is mounted on some other surface, using wax or cement as the media, the hold-down must be as even and thin as possible to prevent overall height variances.
- The substrate or glass slide that the wafer is cemented onto must be flat and parallel to avoid cut/height sawing issues.
How do you release the tape from the material after dicing?
With a UV Curing System. GTS supplies both New and Refurbished Units. View our selection on our Equipments Tab under UV Curing Systems - or follow this link.
What is the wavelength to UV Tape?
365Nm. GTS supplies Maxell Sliontec Ltd Corp. Dicing Tape that compliments a wide variety of materials. View our selection on the Products Tab under Maxell Sliontec Ltd UV Tape - or follow this link.
You can order a free sample by filling out the sample request form by following this link.