New Dicing Saws: SS30

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SS30 Specifications

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New standard for semi-automatic dicers with enhanced operability.

Footprint

  • Small footprint with highly stable structure

Compliant with varieties of work

  • 300mm wafer
  • Alignment with multiple works attachment
  • Deformed and elastic work alignment

High-Resolution Microscope

  • Improved resolution

User Friendly

  • Improved operability with the 17-inch touch panel screen