New Dicing Saws: SS30
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SS30 Specifications
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New standard for semi-automatic dicers with enhanced operability.
Footprint
- Small footprint with highly stable structure
Compliant with varieties of work
- 300mm wafer
- Alignment with multiple works attachment
- Deformed and elastic work alignment
High-Resolution Microscope
User Friendly
- Improved operability with the 17-inch touch panel screen